Cyprian Emeka Uzoh is a genius from Nigeria who holds more than 126 United States issued patents and over 160 patents worldwide in semiconductor technology. He also co-authored more than 35 publications.
In 2006, he was celebrated as Inventor of the Year for the patent "Method of making electroplated interconnection structures on integrated circuit chip" (USPTO 6,709,562), one of the most valuable patents in the field of semiconductor science and technology. He is the main pioneer of modern high performance copper interconnect technologies and has discovered, co-developed and co-implemented the various critical elements and technologies that led to the successful implementation of copper interconnect technology at IBM Corporation, as well as in the entire semiconductor industry.
In other words, this technology enabled the introduction of copper in the making of chips, and it was revolutionary. Cyprian Emeka Uzoh, more than anybody else, was responsible for the discovery of the electroplating technology in this industry.
IBM put this technology into production in the late 1990s and is now the main device wiring method that uses electric field and metal slurries to polish metals at low forces.